78.B1GN3.4040B
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30943484-78.B1GN3.4040B
Memory Modules 4GB DDR4 2400 U-DIMM
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
The memory capacity is the amount of data a device can store at any given time in its memory.
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
Distinct operation recognized by the protection mechanisms as a possible operation on an object.