Anaren X3C25P1-05S

Factory Lead Time

12 Weeks

Package / Case

4-SMD, No Lead

Number of Pins

4

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Series

Xinger III®

Published

2010

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

SMD/SMT

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

95°C

Min Operating Temperature

-55°C

Applications

General Purpose

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

60W

Construction

COMPONENT

Frequency

2.3GHz~2.7GHz

RF/Microwave Device Type

DIRECTIONAL COUPLER

VSWR-Max

1.22

Insertion Loss (dB)

0.18 dB

Input Power-Max (CW)

50dBm

Characteristic Impedance

50Ohm

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

5dB

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant