Analog Devices, Inc. MAT04FPZ

Mount

Through Hole

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Pins

14

Number of Terminals

14

Transistor Element Material

SILICON

Minimum DC Current Gain

300@1mA|200@1mA

Maximum Power Dissipation (mW)

350

Maximum Transition Frequency (MHz)

300(Typ)

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Mounting

Through Hole

Package Height

3.3

Package Width

6.35

Package Length

19.05

PCB changed

14

Standard Package Name

DIP

Supplier Package

PDIP N

Lead Shape

Through Hole

Maximum DC Collector Current (A)

0.03

Maximum Collector-Emitter Saturation Voltage (V)

0.06@100uA@1mA

Maximum Collector-Emitter Voltage (V)

40

Maximum Collector Base Voltage (V)

40

Number of Elements per Chip

4

Category

Bipolar Small Signal

PPAP

No

Automotive

No

HTS

8542.33.00.01

ECCN (US)

EAR99

EU RoHS

Compliant

Number of Elements

4

Voltage Rating (DC)

40 V

RoHS

Compliant

Package Description

PLASTIC, DIP-14

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT APPLICABLE

Operating Temperature-Max

85 °C

Rohs Code

Yes

Transition Frequency-Nom (fT)

300 MHz

Manufacturer Part Number

MAT04FPZ

Package Shape

RECTANGULAR

Manufacturer

Analog Devices Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ANALOG DEVICES INC

Risk Rank

5.19

Part Package Code

DIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e3

Pbfree Code

Yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

ECCN Code

EAR99

Type

NPN

Terminal Finish

Matte Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85 °C

Min Operating Temperature

-40 °C

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW NOISE

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

350 mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT APPLICABLE

Reach Compliance Code

unknown

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

30 mA

Frequency

300 MHz

Pin Count

a count of all of the component leads (or pins)

14

JESD-30 Code

R-PDIP-T14

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

NPN

Configuration

Quad

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

350 mW

Transistor Application

AMPLIFIER

Polarity/Channel Type

NPN

Collector Emitter Voltage (VCEO)

40 V

Max Collector Current

30 mA

Collector Base Voltage (VCBO)

40 V

Collector Current-Max (IC)

0.03 A

DC Current Gain-Min (hFE)

300

Collector-Emitter Voltage-Max

40 V

VCEsat-Max

0.06 V

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Lead Free