AD8381JSTZ

Analog Devices, Inc. AD8381JSTZ

Part No:

AD8381JSTZ

Datasheet:

Package:

-

AINNX NO:

31962637-AD8381JSTZ

Description:

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    48
  • Lead Shape
    Gull-wing
  • Supplier Package
    LQFP
  • Standard Package Name
    QFP
  • PCB changed
    48
  • Package Length
    7
  • Package Width
    7
  • Package Height
    1.4
  • Mounting
    Surface Mount
  • Supplier Temperature Grade
    Commercial
  • Maximum Operating Temperature (°C)
    85
  • Minimum Operating Temperature (°C)
    0
  • Maximum Power Dissipation (mW)
    2700
  • Typical Operating Supply Voltage (V)
    3.3|5|9|12|15
  • Maximum Operating Supply Voltage (V)
    5.5|18
  • Minimum Operating Supply Voltage (V)
    3|9
  • PPAP
    No
  • Automotive
    No
  • ECCN (US)
    EAR99
  • EU RoHS
    Compliant
  • Package Description
    9 X 7 MM, 1.40 MM HEIGHT, MS-026BBC, LQFP-48
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH
  • Moisture Sensitivity Levels
    3
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom
    3.3 V
  • Reflow Temperature-Max (s)
    40
  • Supply Voltage-Min
    3 V
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    AD8381JSTZ
  • Package Code
    LFQFP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Rochester Electronics LLC
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS LLC
  • Supply Voltage-Max
    5.5 V
  • Risk Rank
    5.19
  • Part Package Code
    QFP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code
    e3
  • Pbfree Code
    Yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Terminal Finish
    MATTE TIN
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    48
  • JESD-30 Code
    R-PQFP-G48
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Seated Height-Max
    1.6 mm
  • Interface IC Type
    LIQUID CRYSTAL DISPLAY DRIVER
  • Supply Voltage1-Nom
    15.5 V
  • Number of Segments
    6
  • Multiplexed Display Capability
    NO
  • Data Input Mode
    PARALLEL
  • Supply Voltage1-Min
    9 V
  • Supply Voltage1-Max
    18 V
  • Width
    7 mm
  • Length
    9 mm
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