MAX23438EWO+

Analog Devices MAX23438EWO+

Part No:

MAX23438EWO+

Manufacturer:

Analog Devices

Datasheet:

-

Package:

-

AINNX NO:

39971908-MAX23438EWO+

Category:

Specialized

Description:

IC DISPLAY POWER MANAGEMENT

Products specifications
  • Mounting Type
    Through Hole
  • Material - Insulation
    --
  • Mounting Hole Diameter
    0.070 ~ 0.077 (1.78mm ~ 1.96mm)
  • Length Below Flange
    --
  • Contact Materials
    Brass
  • Length Above Flange
    --
  • Package
    Tray
  • Mfr
    Analog Devices Inc./Maxim Integrated
  • Product Status
    Obsolete
  • Series
    AMPMODU
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Termination
    Press-Fit
  • Insulation Color
    --
  • Contact Finish
    Tin
  • Insulation
    Non-Insulated
  • Terminal Type

    Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

    Single Post
  • Flange Diameter

    Flange diameter is measured between centers of opposite holes in the hub flange. It is usually between 38 and 67 millimeters. Note that it is NOT the outside diameter of the hub's flange. Left and right flange diameters are often, but not always, the same.

    --
  • Terminal Style
    Pin Retention
  • Pin Size - Above Flange
    0.045 (1.14mm) Square
  • Pin Size - Below Flange
    0.045 (1.14mm) Square
  • Contact Finish Thickness
    100.0µin (2.54µm)
  • Length - Overall
    0.580 (14.73mm)
  • Board Thickness
    0.100 (2.54mm)
0 Similar Products Remaining