DS2505P

Analog Devices DS2505P

Part No:

DS2505P

Manufacturer:

Analog Devices

Datasheet:

Package:

4-SMD, No Lead

AINNX NO:

34944974-DS2505P

Category:

Memory

Description:

Otp Rom, 16KX1, 15000NS, Mos, PDSO6

Products specifications
  • Lifecycle Status
    Production (Last Updated: 1 month ago)
  • Mounting Type
    Surface Mount
  • Package / Case
    4-SMD, No Lead
  • Mount
    Surface Mount
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Number of Pins
    6
  • Supplier Device Package
    6-TSOC
  • Package
    Bulk
  • Mfr
    Suntsu Electronics, Inc.
  • Product Status
    Active
  • RoHS
    Compliant
  • Memory Types
    EPROM, EPROMs, OTP
  • Base Product Number
    DS2505
  • Manufacturer Lifecycle Status
    PRODUCTION (Last Updated: 1 month ago)
  • MSL
    MSL 1 - Unlimited
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    6 V
  • Minimum Operating Temperature
    - 40 C
  • Supply Voltage-Min
    2.8 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    1-Wire
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    SXT224
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Size / Dimension
    0.098 L x 0.079 W (2.50mm x 2.00mm)
  • Type
    MHz Crystal
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Technology
    EPROM - OTP
  • Voltage - Supply
    -
  • Frequency
    16 MHz
  • Frequency Stability

    the variation of output frequency of a crystal oscillator due to external conditions like temperature variation, voltage variation, output load variation, and frequency aging.

    ±25ppm
  • ESR (Equivalent Series Resistance)
    100 Ohms
  • Interface
    Serial
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    6 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.8 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2 kB
  • Operating Supply Current
    5 µA
  • Load Capacitance

    the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

    19pF
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    Fundamental
  • Frequency Tolerance

    the maximum allowable deviation from the nominal crystal frequency at a specified temperature, usually 25℃. The recommended frequency tolerance of the crystal over the manufacturing process is ±50 ppm.

    ±20ppm
  • Access Time
    120 µs
  • Memory Format
    EPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    1-Wire®
  • Organization
    16 k x 1
  • Write Cycle Time - Word, Page
    -
  • Density
    16 kb
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    11.5 V to 12 V
  • Memory Organization
    16K x 1
  • Height Seated (Max)
    0.026 (0.65mm)
  • Length
    3.7 mm
  • Height
    1.5 mm
  • Width
    4 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    Unknown
  • Lead Free
    Contains Lead
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