AGB75LC04-QU-E

Amulet Technologies LLC AGB75LC04-QU-E

Part No:

AGB75LC04-QU-E

Package:

208-BFQFP

ROHS:

AINNX NO:

3060543-AGB75LC04-QU-E

Description:

AGB75LC04 Series 3.3 V 5 GPIO GEM Graphical OS Chip? for Color GUI - QFP-206

Products specifications
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    208-BFQFP
  • Memory Types
    SDRAM
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Type
    GUI Processor
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature
    -40°C
  • Reach Compliance Code
    unknown
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.2V
  • Interface
    2-Wire, SPI, UART, USB
  • RAM Size
    160kB
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Max Frequency
    12MHz
  • Number of Cores
    1
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
  • Lead Free
    Lead Free
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