ams-OSRAM USA INC. AS7058-BWLM WLP LF T&R

Mounting Type

Surface Mount

Package / Case

42-UFBGA, WLCSP

Supplier Device Package

42-WLCSP (2.77x2.5)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Number of Channels

3

Number of Bits

20

Voltage - Supply, Analog

1.7V ~ 1.98V

Voltage - Supply, Digital

1.7V ~ 1.98V