AMS CMV50000-1E3M1PA

Mounting Type

Terminal: ¼in QUAD Quick Connect, w/Stud Can

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

THROUGH HOLE MOUNT

Manufacturer

BARKER MICROFARADS INC

RoHS

Y

Operating Temperature-Min

-30 °C

Operating Temperature-Max

70 °C

Rohs Code

Yes

Manufacturer Part Number

CMV50000-1E3M1PA

Horizontal Pixel

7920

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

AMS AG

Risk Rank

5.69

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

2.156in x 1.312in Oval Case

Tolerance

±6%

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

GLOBAL SHUTTER

Capacitance

505uF

Reach Compliance Code

unknown

Voltage

370VAC

Termination Type

SOLDER

Sensors/Transducers Type

IMAGE SENSOR,CMOS

Housing

CERAMIC

Output Interface Type

SPI INTERFACE

Pixel Size

the horizontal and vertical measurements of an image expressed in pixels.

4.6X4.6 µm

Dynamic Range

64 dB

Frame Rate

30 fps

Vertical Pixel

6004

Array Type

FRAME