Ampleon USA Inc. BLP8G10S-45PGY

Factory Lead Time

13 Weeks

Package / Case

4-BESOP (0.173, 4.40mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Transistor Element Material

SILICON

Number of Elements

2

Voltage Rated

RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

65V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

4

ECCN Code

EAR99

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Frequency

952.5MHz~957.5MHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

BLP8G10

Reference Standard

IEC-60134

JESD-30 Code

R-PDSO-G4

Configuration

COMMON SOURCE, 2 ELEMENTS

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Current - Test

224mA

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Transistor Type

LDMOS (Dual), Common Source

Gain

20.8dB

DS Breakdown Voltage-Min

65V

Power - Output

2.5W

FET Technology

METAL-OXIDE SEMICONDUCTOR

Voltage - Test

28V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant