Ampleon BLL6H0514-25

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Housing material

PC, metal shield

Number of Terminals

2

Transistor Element Material

SILICON

Exterior Housing Material

1

Gross weight

28.65

Transport packaging size/quantity

42*28*18.5/200

Name

Shielded Keystone Jack Module

Cable

4x2 STP Cat 5e

Drain Current-Max (ID)

2.5 A

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

(Select First, Then Apply Filters) Compatible Series

har-button, 30.5mm

Package Description

ROHS COMPLIANT, CERAMIC PACKAGE-2

Ihs Manufacturer

AMPLEON NETHERLANDS B V

Part Life Cycle Code

Contact Manufacturer

Full depth

37.8 (mm)

Contact material

phosphor bronze nickel plated with gold plating

Mean time between failures

≥750 cycles

Category

5e

Teral type

punch down IDC type 110min

Screening

full shielded

Series

har-button

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

ECCN Code

EAR99

Connector type

RJ45 8P8C 180 degree

Type

Maintained

Color

zinc alloy

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-CDFM-F2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Actuator Type

Pushbutton, Round

Panel Cutout Dimensions

30.5mm (Round)

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Illumination

Non-Illuminated

Case Connection

SOURCE

Transistor Application

AMPLIFIER

Polarity/Channel Type

N-CHANNEL

Operating temperature range

-30...+68 °C

DS Breakdown Voltage-Min

100 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Requires

Contact Block(s)

Conductor diameter

26-23AWG

Highest Frequency Band

L BAND

Standard

TIA/ EIA 568A/ 568B ISO/ IEC11801

Width

14.6; 16.7 (total) mm

Height

16 (mounting part) mm