MS10B23G10

Amphenol Sine Systems Corp MS10B23G10

Part No:

MS10B23G10

Datasheet:

-

Package:

-

ROHS:

AINNX NO:

5608414-MS10B23G10

Description:

CONN SOCKET 10-12AWG CRIMP GOLD

Products specifications
  • Factory Lead Time
    12 Weeks
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    ecomate®
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Machined
  • Contact Finish
    Gold
  • Wire Gauge

    a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

    10-12 AWG
  • Contact Termination
    Crimp
  • Pin or Socket
    Socket
  • Contact Finish Thickness
    10.0μin 0.25μm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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