RJMG252031130ES

Amphenol Information Communication & Commercial RJMG252031130ES

Part No:

RJMG252031130ES

Datasheet:

-

Package:

-

AINNX NO:

32025681-RJMG252031130ES

Description:

Products specifications
  • Body Orientation
    Right Angle
  • Termination Method
    Solder
  • PPAP
    No
  • Automotive
    No
  • ECCN (US)
    EAR99
  • Package
    Tray
  • Base Product Number
    RJMG2
  • Mfr
    Amphenol ICC (Commercial Products)
  • Product Status
    Obsolete
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    -
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Number of Contacts
    8
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