MSS1583-683MED

Amphenol Information Communication & Commercial MSS1583-683MED

Part No:

MSS1583-683MED

Datasheet:

-

Package:

-

AINNX NO:

31960513-MSS1583-683MED

Description:

Products specifications
  • Number of Terminals
    2
  • Core Material

    Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

    Ferrite
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8504.50.80.00
  • Protection Style
    Shielded
  • Inductance (H)
    68u
  • Inductance Test Frequency (Hz)
    100K
  • Maximum DC Current (A)
    3.4
  • Maximum Saturation Current (A)
    6
  • Maximum DC Resistance (Ohm)
    0.07
  • Minimum Self Resonant Frequency (Hz)
    6M(Typ)
  • Minimum Operating Temperature (°C)
    -40
  • Product Depth (mm)
    15.5
  • Mounting
    Surface Mount
  • Maximum Operating Temperature (°C)
    85
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Tolerance
    20%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Power
  • Product Length (mm)
    15.5
  • Product Height (mm)
    8.6
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