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HM1W41DPR400HEPLF

Amphenol Information Communication & Commercial HM1W41DPR400HEPLF

Part No:

HM1W41DPR400HEPLF

Datasheet:

-

Package:

-

AINNX NO:

31832217-HM1W41DPR400HEPLF

Category:

Backplanes

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Press Fit
  • Terminal Pitch (mm)
    2
  • Body Orientation
    Straight
  • Product Depth (mm)
    15.8
  • Mounting
    Through Hole
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Type
    Hard Metric
  • Gender
    HDR
  • Number of Contacts
    24
  • Product Length (mm)
    11.98
  • Product Height (mm)
    17
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