HB01018000J0G

Amphenol Information Communication & Commercial HB01018000J0G

Part No:

HB01018000J0G

Datasheet:

-

Package:

-

AINNX NO:

32027395-HB01018000J0G

Description:

Products specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • HTS
    8536.69.40.51
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Solder
  • Body Orientation
    Straight
  • Maximum Current Rating (A)
    10/Contact
  • Maximum Voltage Rating
    300VAC
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    115
  • Product Depth (mm)
    12.6
  • Mounting
    Through Hole
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Box
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Type
    Terminal Block
  • Number of Rows
    1
  • Number of Contacts
    1
  • Housing Color
    Gray
  • Number of Circuits
    1
  • Product Length (mm)
    6.6
  • Product Height (mm)
    15.6
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