FOQQD33P00100

Amphenol Information Communication & Commercial FOQQD33P00100

Part No:

FOQQD33P00100

Datasheet:

-

Package:

-

AINNX NO:

32012909-FOQQD33P00100

Description:

Products specifications
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bag
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
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