89037-102LF-WD

Amphenol Information Communication & Commercial 89037-102LF-WD

Part No:

89037-102LF-WD

Datasheet:

-

Package:

-

AINNX NO:

31832691-89037-102LF-WD

Category:

Backplanes

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8536.69.40.30
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Solder
  • Terminal Pitch (mm)
    2
  • Body Orientation
    Right Angle
  • Maximum Current Rating (A)
    1/Contact
  • Insulation Resistance (MOhm)
    1000
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    105
  • Mating Cycle (Cycles)
    250
  • Product Depth (mm)
    21.14
  • Mounting
    Through Hole
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Hard Metric
  • Gender
    RCP
  • Number of Contacts
    96
  • Product Length (mm)
    47.95
0 Similar Products Remaining