7311S0625X01LF

Amphenol Information Communication & Commercial 7311S0625X01LF

Part No:

7311S0625X01LF

Datasheet:

-

Package:

-

AINNX NO:

31936000-7311S0625X01LF

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Terminal Pitch (mm)
    2.54
  • Termination Method
    Solder
  • Body Orientation
    Straight
  • Maximum Current Rating (A)
    1/Contact
  • Maximum Voltage Rating
    1000VAC
  • Insulation Resistance (MOhm)
    1000
  • Maximum Contact Resistance (mOhm)
    100
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    90
  • Mating Cycle (Cycles)
    10000
  • Mounting
    Surface Mount
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    SIM Card
  • Number of Rows
    2
  • Gender
    M
  • Number of Contacts
    8
  • Product Length (mm)
    25.9
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