10106266-2003002LF

Amphenol Information Communication & Commercial 10106266-2003002LF

Part No:

10106266-2003002LF

Datasheet:

-

Package:

-

AINNX NO:

31938743-10106266-2003002LF

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Termination Method
    Solder
  • Body Orientation
    Straight
  • Maximum Current Rating (A)
    58/Contact
  • Maximum Voltage Rating
    912V/124V
  • Insulation Resistance (MOhm)
    1000
  • Mating Cycle (Cycles)
    500
  • Tail Length (mm)
    3.43
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Rows
    1/4
  • Gender
    HDR
  • Number of Contacts
    2Power/12Signal
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