Amphenol Information Communication & Commercial 10056265-122ABSLF

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Terminal Pitch (mm)

1

Termination Method

Solder

Body Orientation

Right Angle

Maximum Current Rating (A)

0.75/Contact

Maximum Voltage Rating

3.3V

Insulation Resistance (MOhm)

1000

Maximum Contact Resistance (mOhm)

40

Maximum Insertion Force

39N

Mating Cycle (Cycles)

5000

Product Depth (mm)

17.25

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Express Card Host

Number of Rows

1

Gender

HDR

Number of Contacts

26

Terminal Plating

Tin Over Nickel

Product Length (mm)

40.2

Product Height (mm)

7.7