Amphenol ICC (FCI) 8609F3114C1

Base Product Number

8609F311

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Coaxial

Contact Finish

Gold

Contact Termination

Solder

Pin or Socket

Socket, Center

Contact Finish Thickness

31.5μin (0.80μm)