Amphenol ICC (FCI) 10118534-003RLF

Factory Lead Time

19 Weeks

Material

Beryllium Copper Alloy

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Shield Finger, Pre-Loaded

Plating

Gold

Attachment Method

Solder

Height

0.061 1.55mm

Length

0.137 3.48mm

Width

0.059 1.50mm

Plating Thickness

Flash

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant