Amphenol Aerospace Operations LMD-06PJ1

Factory Lead Time

18 Weeks

Mount

Panel

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

LMD

Published

2013

Size / Dimension

5.045Lx1.000W x 0.740 H 128.14mmx25.40mmx18.80mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Module Housing

Number of Positions

6

Module Capacity

6

Height

18.796mm

Length

128.143mm

Width

25.4mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant