Amphenol SIME3023PNC

Mounting Type

Through Hole

Package / Case

R-1 (Axial)

Supplier Device Package

R-1

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 1000V

Voltage - Forward (Vf) (Max) @ If

1V @ 1A

Operating Temperature - Junction

-65°C ~ 125°C

Voltage - DC Reverse (Vr) (Max)

1000V

Current - Average Rectified (Io)

1A

Capacitance @ Vr, F

15pF @ 4V, 1MHz