Amphenol JPEPL5039INI

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

a group of products which fulfill a similar need for a market segment or market as a whole.

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

a particular group of related products.