AMP 21024-1

Lifecycle Status

Production (Last Updated: 2 years ago)

Mount

Surface Mount

Number of Pins

6

Material

Steel

Number of Elements

2

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Series

--

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Split Lock

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

800 mW

Plating

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Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

800 mW

Drain to Source Voltage (Vdss)

20 V

Continuous Drain Current (ID)

4.6 A

Gate to Source Voltage (Vgs)

12 V

Input Capacitance

The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

780 pF

Rds On Max

23 mΩ

Thread/Screw/Hole Size

#2

Thickness

0.020 (0.51mm)

Diameter - Outside

0.172 (4.37mm)

Diameter - Inside

0.091 (2.31mm)