AMI Semiconductor QED234A4R0

Package / Case

Radial, 5mm Dia (T 1 3/4)

Mounting Type

Through Hole

Material

Elastomer

Shape

Square

Package

Bulk

Mfr

Laird Technologies - Thermal Materials

Product Status

Obsolete

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Series

Tflex™ XS400

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TA)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Gap Filler Pad, Sheet

Color

Gray

Orientation

Top View

Voltage - Forward (Vf) (Typ)

1.6V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

40°

Usage

-

Shelf Life

-

Adhesive

Tacky - One Side

Storage/Refrigeration Temperature

-

Shelf Life Start

-

Backing, Carrier

-

Wavelength

940nm

Outline

228.60mm x 228.60mm

Current - DC Forward (If) (Max)

100mA

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

2.0W/m-K

Radiant Intensity (Ie) Min @ If

27mW/sr @ 100mA

Thermal Resistivity

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

-

Thickness

0.0700 (1.778mm)