AMI Semiconductor NUS2045MNT1

Mounting Type

Surface Mount

Package / Case

8-VDFN Exposed Pad

Supplier Device Package

8-DFN-EP (3.3x3.3)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Applications

General Purpose

Technology

Mixed Technology

Number of Circuits

1

Voltage - Clamping

7.08V