AMI Semiconductor NGTD15R65F2WP

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Speed

-

Diode Type

Standard

Current - Reverse Leakage @ Vr

1µA @ 650V

Voltage - Forward (Vf) (Max) @ If

2.9V @ 25A

Operating Temperature - Junction

175°C (Max)

Voltage - DC Reverse (Vr) (Max)

650V

Current - Average Rectified (Io)

-

Capacitance @ Vr, F

-