AMI Semiconductor MURS110T3G

Mounting Type

Surface Mount

Package / Case

DO-214AA, SMB

Supplier Device Package

SMB

RoHS

Non-Compliant

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

MURS110T3GOSCT

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Base Part Number

MURS110

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

2µA @ 100V

Voltage - Forward (Vf) (Max) @ If

875mV @ 1A

Operating Temperature - Junction

-65°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

2A

Capacitance @ Vr, F

-

Reverse Recovery Time (trr)

35ns