AMI Semiconductor M74LCX16373DTR2G

Mounting Type

Surface Mount

Package / Case

8-WDFN Exposed Pad

Supplier Device Package

8-WSON (8x6)

Package

Tape & Reel (TR)

Base Product Number

W25M02

Mfr

Winbond Electronics

Product Status

Obsolete

Memory Types

Non-Volatile

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

M74LCX16373DTR2G-ND M74LCX16373DTR2GOSTR

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

SpiFlash®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Technology

FLASH - NAND (SLC)

Voltage - Supply

2.7V ~ 3.6V

Base Part Number

74LCX16373

Output Type

Tri-State

Circuit

8:8

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

2Gbit

Clock Frequency

104 MHz

Memory Format

FLASH

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

SPI

Current - Output High, Low

24mA, 24mA

Logic Type

D-Type Transparent Latch

Write Cycle Time - Word, Page

700µs

Independent Circuits

2

Delay Time - Propagation

5.4ns

Memory Organization

256M x 8