AMI Semiconductor KA555IDTF

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173, 4.40mm Width)

Supplier Device Package

20-TSSOP

Number of I/Os

16

Package

Tube

Base Product Number

MC908

Mfr

NXP USA Inc.

Data Converters

A/D 10x10b

Product Status

Obsolete

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

HC08

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

555 Type, Timer/Oscillator (Single)

Voltage - Supply

4.5 V ~ 16 V

Frequency

-

Base Part Number

KA555

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

Speed

8MHz

RAM Size

384 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Core Processor

HC08

Peripherals

LVD, POR, PWM

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

8KB (8K x 8)

Connectivity

SCI, SPI

Current - Supply

7.5mA

EEPROM Size

-

Count

-