XCZU15EG-2LFFVC900E

AMD Xilinx XCZU15EG-2LFFVC900E

Part No:

XCZU15EG-2LFFVC900E

Manufacturer:

AMD Xilinx

Datasheet:

Package:

-

AINNX NO:

69169510-XCZU15EG-2LFFVC900E

Description:

Microprocessor Circuit,

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    900
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    XILINX INC
  • Date Of Intro
    2018-03-09
  • Moisture Sensitivity Levels
    4
  • Operating Temperature-Max
    110 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Equivalence Code
    BGA900,30X30,40
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • Supply Voltage-Nom
    0.85 V
  • JESD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • Time@Peak Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B900
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Seated Height-Max
    3.42 mm
  • Bus Compatibility
    CAN, I2C, SPI, UART
  • Length
    31 mm
  • Width
    31 mm
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