AMD XQ7Z030-2RF900I

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

900

Rohs Code

No

Part Life Cycle Code

Active

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

31 X 31 MM, 1 MM PITCH, BGA-900

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

GRID ARRAY

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B900

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

uPs/uCs/Peripheral ICs Type

PROGRAMMABLE SoC

Seated Height-Max

3.44 mm

Length

31 mm

Width

31 mm