AMD XCZU9CG-L1FBVB900I

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

900

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

BGA-900

Moisture Sensitivity Levels

4

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Supply Voltage-Max

0.742 V

Supply Voltage-Min

0.698 V

Supply Voltage-Nom

0.72 V

JESD-609 Code

e1

Terminal Finish

TIN SILVER COPPER

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

245

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

30

JESD-30 Code

S-PBGA-B900

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

uPs/uCs/Peripheral ICs Type

PROGRAMMABLE SoC

Seated Height-Max

2.88 mm

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Length

31 mm

Width

31 mm