AMD XCR3384XL-12PQG208I

Mounting Type

Surface Mount

Package / Case

208-BFQFP

Supplier Device Package

208-PQFP (28x28)

Factory Pack QuantityFactory Pack Quantity

1

Part # Aliases

611-0037-3-63

Manufacturer

Hirose Electric

Brand

Hirose Connector

Number of I/Os

172

Package

Tray

Number of Macrocells

384

Base Product Number

XCR3384

Mfr

AMD

Product Status

Obsolete

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

CoolRunner XPLA3

Subcategory

Headers & Wire Housings

Programmable Type

These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

In System Programmable (min 1K program/erase cycles)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Headers & Wire Housings

Number of Gates

The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

9000

Voltage Supply - Internal

2.7V ~ 3.6V

Delay Time tpd(1) Max

10.8 ns

Number of Logic Elements/Blocks

24

Product Category

a particular group of related products.

Headers & Wire Housings