AMD XC7Z030-L2FFG676I

Mounting Type

Surface Mount, MLCC

Package / Case

0402 (1005 Metric)

Supplier Device Package

676-FCBGA (27x27)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Voltage Rated

RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

25V

Device Logic Units

125,000

Supplier Package

FCBGA

Typical Operating Supply Voltage

1.0000 V

Minimum Operating Supply Voltage

0.95 V

Maximum Number of User I/Os

250

Maximum Operating Supply Voltage

1.05 V

Mounting

Surface Mount

Number of I/Os

130

Package

Tray

Base Product Number

XC7Z030

Mfr

AMD

Product Status

Active

Usage Level

Industrial grade

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 125°C

Series

VJ HIFREQ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Size / Dimension

0.040 L x 0.020 W (1.02mm x 0.51mm)

Tolerance

±0.5pF

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

C0G, NP0

Applications

RF, Microwave, High Frequency

Capacitance

0.9pF

Pin Count

a count of all of the component leads (or pins)

676

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

-

Speed

800MHz

RAM Size

256KB

Lead Style

-

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Screening Level

Industrial

Speed Grade

2L

Primary Attributes

Kintex™-7 FPGA, 125K Logic Cells

Number of Registers

157,200

Flash Size

-

Features

High Q, Low Loss

Height Seated (Max)

-

Thickness (Max)

0.024 (0.61mm)

Ratings

-