AMD HW-XGI-DEBUG-G

Mount

Through Hole

Number of Pins

3

Schedule B

8541290080

RoHS

Non-Compliant

Package

Box

Mfr

AMD

Product Status

Obsolete

For Use With/Related Products

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

-

Type

Debugger

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-55 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

4 W

Drain to Source Voltage (Vdss)

100 V

Continuous Drain Current (ID)

38 A

Contents

Board(s)

Rds On Max

65 mΩ