AMD HW-AFX-FF1513-400

Mount

Surface Mount

RoHS

Compliant

Package

Box

Base Product Number

-

Mfr

AMD

Product Status

Obsolete

For Use With/Related Products

Virtex-4

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

Virtex®-4

Type

FPGA

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

75 °C

Min Operating Temperature

-25 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

900 mW

Note

-

Number of Circuits

1

Operating Supply Current

3.8 mA

Contents

Board(s)

Platform

-

Interconnect System

-

Suggested Programming Environment

-

Lead Free

Lead Free