EPXA1F672C3

ALTERA EPXA1F672C3

Part No:

EPXA1F672C3

Manufacturer:

ALTERA

Datasheet:

-

Package:

672-BBGA, FCBGA

AINNX NO:

34727629-EPXA1F672C3

Description:

IC EXCALIBUR ARM 672FBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    672-BBGA, FCBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package
    672-FBGA (27x27)
  • Number of Terminals
    672
  • Package
    Tray
  • Mfr
    Altera
  • Product Status
    Obsolete
  • Package Description
    BGA,
  • Package Style
    GRID ARRAY
  • Moisture Sensitivity Levels
    3
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom
    1.8 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Supply Voltage-Min
    1.71 V
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    EPXA1F672C3
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Manufacturer
    Rochester Electronics LLC
  • Part Life Cycle Code
    Active
  • Number of I/O Lines
    246
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS INC
  • Supply Voltage-Max
    1.89 V
  • Risk Rank
    5.85
  • Part Package Code
    BGA
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C
  • Series
    Excalibur™
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Terminal Finish
    TIN LEAD
  • Voltage - Supply
    1.8V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    672
  • JESD-30 Code
    S-PBGA-B672
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Interface
    EBI/EMI, UART/USART
  • Speed
    166MHz
  • Organization
    0 DEDICATED INPUTS, 246 I/O
  • Seated Height-Max
    2.1 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    LOADABLE PLD
  • EEPROM Size
    --
  • Output Function

    An output function is a function that an optimization function calls at each iteration of its algorithm. Typically, you use an output function to generate graphical output, record the history of the data the algorithm generates, or halt the algorithm based on the data at the current iteration.

    MACROCELL
  • Core Type
    32-Bit ARM9
  • Data SRAM Bytes

    SRAM (static RAM) is random access memory (RAM) that retains data bits in its memory as long as power is being supplied. SRAM is used for a computer's cache memory and as part of the random access memory digital-to-analog converter on a video card.

    16K
  • FPGA Gates
    100K
  • Program SRAM Bytes
    32K
  • FPGA Core Cells
    4160
  • FPGA SRAM
    --
  • Width
    27 mm
  • Length
    27 mm
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