ALTERA 10AS066K2F40E2LG

Package / Case

1517-BBGA, FCBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

1517-FBGA (40x40)

Number of Terminals

1517

Package

Bulk

Base Product Number

112180

Mfr

Molex

Product Status

Active

Number of I/Os

696

Package Description

BGA, BGA1517,39X39,40

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA1517,39X39,40

Supply Voltage-Nom

0.9 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

0.87 V

Operating Temperature-Max

100 °C

Rohs Code

Yes

Manufacturer Part Number

10AS066K2F40E2LG

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Active

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

0.93 V

Risk Rank

5.46

Series

*

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 100°C (TJ)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Subcategory

Field Programmable Gate Arrays

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B1517

Number of Outputs

696

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

0.9 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

1.5GHz

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Number of Inputs

696

Seated Height-Max

3.5 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 660K Logic Elements

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

660000

Flash Size

--

Width

40 mm

Length

40 mm