Allegro MicroSystems 2SC3284

Material

Si

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

HTS

8542330001

Automotive

No

PPAP

No

Category

Bipolar Power

Number of Elements per Chip

1

Maximum Collector Base Voltage (V)

150

Maximum Collector-Emitter Voltage (V)

150

Maximum Emitter Base Voltage (V)

5

Maximum Collector-Emitter Saturation Voltage (V)

[email protected]@5A

Maximum DC Collector Current (A)

14

Minimum DC Current Gain

50@5A@4V

Maximum Power Dissipation (mW)

125000

Maximum Transition Frequency (MHz)

60(Typ)

Maximum Operating Temperature (°C)

150

Mounting

Through Hole

Package Height

17.9

Package Width

4.8

Package Length

15.6

PCB changed

3

Tab

Tab

Standard Package Name

TO-3P

Supplier Package

TO-3P

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

NPN

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single