AGASTAT 2170139-1

Package / Case

CSON

Mounting Type

Through Hole, Right Angle

Product Depth (mm)

2.5(mm)

Operating Temp Range

-20C to 70C

Rad Hardened

No

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Usage Level

Commercial grade

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Press-Fit

Connector Type

SFP+

Number of Positions

-

Contact Finish

-

Connector Style

Cage, Ganged (1 x 2)

Screening Level

Commercial

Features

EMI Shielded, Light Pipe

Product Length (mm)

3.2(mm)

Contact Finish Thickness

-

Product Height (mm)

1.05(mm)