AGASTAT 1-87022-7

Mounting Type

Surface Mount

Package / Case

TO-263-3, D²Pak (2 Leads + Tab) Variant

Supplier Device Package

TO-263AC (SMPD)

Material - Insulation

-

Mounting Hole Diameter

0.036 (0.91mm)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Length Below Flange

-

Contact Materials

Phosphor Bronze

Length Above Flange

-

Series

Automotive, AEC-Q101, eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Press-Fit

Insulation Color

-

Contact Finish

Gold

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

15µA @ 100V

Voltage - Forward (Vf) (Max) @ If

1.15V @ 10A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

200V

Current - Average Rectified (Io)

3A

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Single Post

Capacitance @ Vr, F

67pF @ 4V, 1MHz

Flange Diameter

Flange diameter is measured between centers of opposite holes in the hub flange. It is usually between 38 and 67 millimeters. Note that it is NOT the outside diameter of the hub's flange. Left and right flange diameters are often, but not always, the same.

-

Terminal Style

Smooth

Pin Size - Above Flange

0.025 (0.64mm) Square

Pin Size - Below Flange

0.025 (0.64mm) Square

Reverse Recovery Time (trr)

3µs

Contact Finish Thickness

30.0µin (0.76µm)

Length - Overall

0.828 (21.03mm)

Board Thickness

-