Mounting Type
Through Hole
Package / Case
TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package
TO-92-3
Package
Bulk
Current - Continuous Drain (Id) @ 25℃
180mA (Ta)
Mfr
Fairchild Semiconductor
Product Status
Active
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other Names
076650-0179 076650-0179-E 0766500179 0766500179-E 76650-0179-E 766500179 766500179-E K-904 WM8500
Series
-
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Plastic Box with Bin Guide
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Technology
MOSFET (Metal Oxide)
FET Type
P-Channel
Rds On (Max) @ Id, Vgs
10Ohm @ 500mA, 10V
Vgs(th) (Max) @ Id
3.5V @ 1mA
Input Capacitance (Ciss) (Max) @ Vds
60 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs
1.43 nC @ 10 V
Drain to Source Voltage (Vdss)
60 V
FET Feature
-
Kit Type
Rectangular - Contact, Header, Housing
Values
139 pcs - 6, 8, 10, 12, 14, 16 Circuit Header, Housing, 24 ~ 22 AWG Crimp Terminals, Insertion Tool