Affinity Medical Technologies 0877971001

Mounting Type

Through Hole

Number of Terminals

2

Case Size

Not Required

Lead Spacing (nom)

67.6(mm)

Product Depth (mm)

25.7(mm)

Operating Temp Range

-40C to 125C

Case Style

Aluminum Housed

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Bolt-On

Tolerance (+ or -)

10%

Power Rating(s)

158(W)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

087797-1001 87797-1001 877971-1001 877971001

Series

C-Grid 87797

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±100(ppm/°C)

Type

Thick Film

Resistance

10(ohm)

Number of Positions

10

Color

Black

Number of Rows

2

Pitch

0.100 (2.54mm)

Construction

Rectangular

Military Standard

Not Required

Termination Style

Solder Lug

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Contact Finish - Post (Mating)

Tin

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.100 (2.54mm)

Product Length (mm)

104(mm)

Length - Stack Height

0.750 (19.050mm)

Length - Overall Pin

1.265 (32.131mm)

Length - Post (Mating)

0.425 (10.800mm)

Contact Finish Thickness - Post (Mating)

100.0µin (2.54µm)

Length - Tail

0.090 (2.286mm)

Product Height (mm)

25(mm)