Mounting Type
Surface Mount
Package / Case
DO-219AB
Supplier Device Package
DO-219AB (SMF)
Material - Insulation
Poly-Vinyl Chloride (PVC)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other Names
019070-0292 190700292 BB-223-08X BULK
Contact Materials
Copper
Series
Automotive, AEC-Q101, eSMP®
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR)
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Crimp
Color
Blue
Contact Finish
Electro-Tin
Wire Gauge
a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.
14-16 AWG
Speed
Fast Recovery = 200mA (Io)
Diode Type
Schottky
Current - Reverse Leakage @ Vr
220µA @ 40V
Voltage - Forward (Vf) (Max) @ If
580mV @ 2A
Operating Temperature - Junction
-55°C ~ 150°C
Voltage - DC Reverse (Vr) (Max)
40V
Current - Average Rectified (Io)
2A
Insulation Diameter
0.175 (4.45mm)
Insulation
Insulated
Terminal Type
Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.
Circular
Capacitance @ Vr, F
125pF @ 4V, 1MHz
Stud/Tab Size
8 Stud
Features
-
Thickness
0.031 (0.79mm)
Length - Overall
0.785 (19.94mm)
Width - Outer Edges
0.260 (6.60mm)