JANTXV2N6301

Aeroflex JANTXV2N6301

Part No:

JANTXV2N6301

Manufacturer:

Aeroflex

Datasheet:

-

Package:

-

AINNX NO:

31948237-JANTXV2N6301

Description:

Products specifications
  • Mount
    Through Hole
  • ECCN (US)
    EAR99
  • HTS
    8541.29.00.95
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Number of Elements per Chip
    1
  • Maximum Collector-Emitter Voltage (V)
    80
  • Maximum Collector Base Voltage (V)
    80
  • Maximum Emitter Base Voltage (V)
    5
  • Maximum Base Emitter Saturation Voltage (V)
    4@80mA@8A
  • Maximum Continuous DC Collector Current (A)
    8
  • Maximum Collector-Emitter Saturation Voltage (V)
    2@16mA@4A|3@80mA@8A
  • Minimum DC Current Gain
    500@1A@3V|750@4A@3V|100@8A@3V
  • Maximum Power Dissipation (mW)
    75000
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    200
  • Supplier Temperature Grade
    Military
  • Mounting
    Through Hole
  • Package Height
    8.64(Max)
  • Package Width
    17.78
  • Package Length
    24.43(Max) + 7.36
  • PCB changed
    2
  • Tab
    Tab
  • Standard Package Name
    TO-213-AA
  • Supplier Package
    TO-66
  • Lead Shape
    Through Hole
  • Emitter-Base Voltage
    5(V)
  • Base-Emitter Saturation Voltage (Max)
    4(V)
  • Operating Temperature Classification
    Military
  • Package Type
    TO-66
  • Collector-Base Voltage
    80(V)
  • Operating Temp Range
    -55C to 200C
  • Collector Current (DC)
    8(A)
  • Number of Elements
    1
  • Rad Hardened
    No
  • Collector-Emitter Voltage
    80(V)
  • DC Current Gain
    500
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    NPN
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Polarity
    NPN
  • Configuration
    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    75(W)
  • Collector Emitter Voltage (VCEO)
    80 V
  • Collector Base Voltage (VCBO)
    80 V
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
0 Similar Products Remaining