Aeroflex JANS2N3637UB

Material

Si

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Category

Bipolar Power

Number of Elements per Chip

1

Maximum Collector Base Voltage (V)

175

Maximum Collector-Emitter Voltage (V)

175

Maximum Emitter Base Voltage (V)

5

Maximum Base Emitter Saturation Voltage (V)

0.8@1mA@10mA|0.9@5mA@50mA

Maximum Collector-Emitter Saturation Voltage (V)

0.3@1mA@10mA|0.6@5mA@50mA

Maximum DC Collector Current (A)

1

Minimum DC Current Gain

[email protected]@10V|90@1mA@10V|100@10mA@10V|100@50mA@10V|60@150mA@10V

Maximum Power Dissipation (mW)

1000

Minimum Operating Temperature (°C)

-65

Maximum Operating Temperature (°C)

200

Supplier Temperature Grade

Military

Mounting

Surface Mount

Package Height

1.42(Max)

Package Width

2.74(Max)

Package Length

3.25(Max)

PCB changed

4

Supplier Package

Case UB

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Waffle

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

PNP

Pin Count

a count of all of the component leads (or pins)

4

Configuration

Single